Copper alloy containing cobalt, nickel and silicon

Details Copper alloy containing cobalt, nickel and silicon Copper alloy containing cobalt, nickel and silicon

2007-02-27

2007-02-27

Lp, Sikyin (Department: 1742)

Metal treatment

Stock

Copper base

C148S433000, C148S434000, C148S436000

Reexamination Certificate

active

10610433

ABSTRACT:
A copper alloy having an improved combination of yield strength and electrical conductivity consists essentially of, by weight, from 1% to 2.5% of nickel, from 0.5% to 2.0% of cobalt, from 0.5% to 1.5% of silicon, and the balance is copper and inevitable impurities. Further, the total nickel plus cobalt content is from 1.7% to 4.3%, the ratio of nickel to cobalt is from 1.01:1 to 2.6:1, the amount of (Ni+Co)/Si is between 3.5 and 6, the electrical conductivity is in excess of 40% IACS and the yield strength is in excess of 95 ksi. An optional inclusion is up 1% of silver. A process to manufacture the alloy includes the sequential steps of (a). casting; (b). hot working; (c). solutionizing; (d). first age annealing; (e). cold working; and (f). second age annealing wherein the second age annealing temperature is less than the first age annealing temperature.

REFERENCES:
patent: 2157934 (1939-05-01), Hensel et al.
patent: 2178992 (1939-11-01), Hensel et al.
patent: 4191601 (1980-03-01), Edens et al.
patent: 4260435 (1981-04-01), Edens et al.
patent: 4687633 (1987-08-01), Miyafuji et al.
patent: 4692192 (1987-09-01), Ikushima et al.
patent: 4792365 (1988-12-01), Matsui et al.
patent: 5028391 (1991-07-01), Ingerson
patent: 5147469 (1992-09-01), Kanzai et al.
patent: 5846346 (1998-12-01), Lee et al.
patent: 6251199 (2001-06-01), Mandigo et al.
patent: 6334915 (2002-01-01), Ogura et al.
patent: 6506269 (2003-01-01), Liu et al.
patent: 2002/0012603 (2002-01-01), Miwa
patent: 2002/0029827 (2002-03-01), Liu et al.
patent: 2002/0096662 (2002-07-01), Scheicher et al.
patent: 0018818 (1980-11-01), None
patent: 2706488 (1994-12-01), None
patent: 1358055 (1974-06-01), None
patent: 59(1984)-145746 (1984-08-01), None
patent: 59(1984)-145749 (1984-08-01), None
patent: 63-109134 (1988-05-01), None
patent: 63105943 (1988-05-01), None
patent: 3(1991)-4613 (1991-01-01), None
patent: 3-162553 (1991-07-01), None
patent: 05179377 (1993-07-01), None
patent: 05-222467 (1993-08-01), None
patent: 06-184681 (1994-07-01), None
patent: 07090520 (1995-04-01), None
patent: 09-020943 (1997-01-01), None
patent: 10296398 (1998-11-01), None
patent: 11(1999)-222641 (1999-08-01), None
patent: 119918 (1982-01-01), None
patent: 456019 (1975-01-01), None
Huang, F. et al., “Precipitation in Cu-Ni-Si-Zn alloy for lead frame,”Materials Letters57 (2003), pp. 2135-2139.

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