Copolyester-amide resin and adhesive processes

Details Copolyester-amide resin and adhesive processes Copolyester-amide resin and adhesive processes

1975-04-07

1977-01-25

Van Horn, Charles E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156332, 260 75N, 260 78R, 260 75T, 260857PE, 428423, 428480, 428424, C09J 302

Patent

active

040049604

ABSTRACT:
Thermoplastic esteramide heterophase copolymer resin including saturated copolyester soft segments chemically joined to copolyamide hard segments, in proportions and copolymerized to an extent to give a melt viscosity, extended tack after melt application and room temperature hardness for use as a hot melt adhesive in the manufacture of shoes.

REFERENCES:
patent: 2281415 (1942-04-01), Coffman
patent: 3247536 (1966-04-01), Rossitto et al.
patent: 3436301 (1969-04-01), McHall
patent: 3468975 (1969-09-01), Buxbury et al.
patent: 3475385 (1969-10-01), Goodman et al.
patent: 3849514 (1974-11-01), Gray et al.
patent: 3852246 (1974-12-01), Schmidt et al.

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