Cooling system for semiconductor die carrier

Details Cooling system for semiconductor die carrier Cooling system for semiconductor die carrier

1997-11-14

2000-02-29

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

H05K 720

Patent

active

060317205

ABSTRACT:
A cooling system for a semiconductor die carrier is disclosed that includes a cooling fan disposed at a substantial distance from a semiconductor die carrier, a cooling duct including an inlet portion and an outlet portion, and a heat exchanger disposed on an upper surface of the semiconductor die carrier. The cooling duct inlet portion is attached to the cooling fan and the cooling duct outlet portion is disposed in close proximity to the heat exchanger. The cooling fan draws ambient air into the cooling duct and the ambient air exits the cooling duct outlet portion and passes in a heat exchange relationship with the heat exchanger.

REFERENCES:
patent: 4674004 (1987-06-01), Smith et al.
patent: 5077601 (1991-12-01), Hatada et al.
patent: 5428503 (1995-06-01), Matsushima et al.
patent: 5563768 (1996-10-01), Perdue
patent: 5597035 (1997-01-01), Smith et al.
patent: 5763950 (1998-06-01), Fujisaki et al.
patent: 5828549 (1998-10-01), Gandre et al.

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