Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1992-04-24
1994-02-15
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257712, 257717, 361704, 361714, 165 802, 165185, H01L 2302
Patent
active
052870014
ABSTRACT:
Cooling structure for direct heat transfer between an active layer of a chip in which electric elements are formed and a heat sink are disclosed. The inventive cooling structure consists of a current/voltage supply level, with metal structures and insulation spacers and/or layers, partly covered by an insulation layer and followed by a heat transfer structure. A heat transfer bridge is in thermal connection with the heat transfer structure that provides for heat flux between the inventive cooling structure and the heat sink. The inventive cooling structure of this invention can be used with semiconductor devices and/or with opto-electronic devices.
REFERENCES:
patent: 3896544 (1975-07-01), Fosnough
patent: 4479140 (1984-10-01), Horvath
patent: 4827376 (1989-05-01), Voss
patent: 4829403 (1989-05-01), Harding
IBM Technical Disclosure Bulletin, vol. 20, No. 5, p. 1768, Oct. 1977, E. E. Zirnis, "Semiconductor Module with Improved Air Cooling."
IBM Technical Disclosure Bulletin, vol. 20, No. 8, p. 3223, Jan. 1978, O. R. Gupta, "Chip/Can Conduction Path."
IBM Technical Disclosure Bulletin, vol. 27, No. 7B, pp. 4413-4415, Dec. 1984, W. C. Yeh, "Bump Internal-Thermal Enhancement".
"Microelectronics Packaging Handbook", copyright 1989 Van Nostrand Reinhold, pp. 48.varies.49 and 338, R. R. Tummala and E. J. Rymaszewski.
Buchmann Peter
Unger Peter
Vettiger Peter
Voegeli Otto
Ahsan Aziz M.
Hille Rolf
International Business Machines - Corporation
Ostrowski David
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