Cooling of semiconductor power modules by flushing with dielectr

Details Cooling of semiconductor power modules by flushing with dielectr Cooling of semiconductor power modules by flushing with dielectr

1993-11-02

1995-09-05

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257715, 361699, 361719, 361720, H01L 2504, H01L 2302

Patent

active

054481082

ABSTRACT:
Semiconductor dies (30-40) are mounted on a printed wiring board (28) to be vertically oriented. They are enclosed in a housing (12) which is supplied with an upwardly flowing dielectric liquid coolant. Nozzles (18,20) direct the dielectric liquid coolant to flow upward over the dies and printed wiring board. Heat is directly extracted from the dies.

REFERENCES:
patent: 4694323 (1987-09-01), Itahana et al.
patent: 4757370 (1988-07-01), Agonafer et al.
patent: 4847731 (1989-07-01), Smolley
patent: 4949164 (1990-08-01), Ohashi et al.
patent: 5262921 (1993-11-01), Lamers
patent: 5270572 (1993-12-01), Nakajima et al.

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