Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section
Patent
1984-10-26
1987-02-17
Lee, John
Heat exchange
With valve or movable deflector for heat exchange fluid flow
With by-pass of heat exchanger or heat exchanger section
165 804, 361385, H01L 2504
Patent
active
046443851
ABSTRACT:
This invention concerns a cooling module for integrated circuit chips, characterized in that it is provided with cooling members through which a coolant circulates, and which are connected directly, or via insulating plates, to a plurality of integrated circuit chips mounted on a wiring substrate, and pipes which introduce the coolant into the cooling members and which have a resiliency which is high enough to enable the pipes to expand and contract in the direction perpendicular to the wiring substrate.
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IBM Technical Disclosure Bulletin, vol. 20, No. 10, Mar. 1978, Pascuzzo et al., "Integrated Circuit Module Package Cooling Structure", pp. 3898-3899.
IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, Anacker, "Liquid Cooling of Integrated Circuit Chips", pp. 3742-3743.
IBM Technical Disclosure Bulletin, vol. 19, No. 4, Sep. 1976, Jeannotte, "Circuit Module with Gallium Metal Cooling Structure", p. 1348.
IBM Technical Disclosure Bulletin, vol. 23, No. 2, Jul. 1980, Amendola, "Cooling Structure for an Integrated Circuit Module", p. 602.
Electronics, vol. 55, No. 17, Aug. 25, 1982, Fields, "Grooved Substrate Boosts IC Cooling", pp. 46-47.
Chiba Katuaki
Imai Kuninori
Masaki Akira
Nakanishi Keiichirou
Yamada Minoru
Hitachi , Ltd.
Lee John
LandOfFree
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