4. Metal fusion bonding
  5. Process
  6. Bonding nonmetals with metallic filler

Katuaki Chiba

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Cooling module for integrated circuit chips

Heat exchange – With valve or movable deflector for heat exchange fluid flow – With by-pass of heat exchanger or heat exchanger section
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Method for fabricating composite structure

Metal fusion bonding – Process – Bonding nonmetals with metallic filler
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Mount for a light emitting device

Electric lamp and discharge devices – With luminescent solid or liquid material – Solid-state type
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Optical coupling device and method of making the same

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Parallel optical switching apparatus

Static information storage and retrieval – Radiant energy – Chemical fluids
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Profile ID: LFUS-PAI-P-882567

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