Cooling apparatus for electronics

Heat exchange – Conduit within – or conforming to – panel or wall structure

Reexamination Certificate

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Details

C165S080500

Reexamination Certificate

active

07624791

ABSTRACT:
In one embodiment, an apparatus includes a monolithically formed thermal conducting body that includes a passageway that extends from a first end to a second end of the body. At least one of the first end or the second end of the body is configured to couple the body to a tubular member. The body also defines a substantially non-circular outer perimeter, and at least a portion of the passageway of the body defines a substantially circular cross-section. The passageway of the body is configured to receive fluid there through, and the body has a substantially planar outer surface that is configured to be placed in contact with a heat generating component. In some embodiments, the body can be coupled to a plate. In some embodiments, an apparatus can include more than one such thermal conducting body.

REFERENCES:
patent: 5159529 (1992-10-01), Lovgren
patent: 5499450 (1996-03-01), Jacoby
patent: 5526231 (1996-06-01), Arz
patent: 5826645 (1998-10-01), Meyer
patent: 5829516 (1998-11-01), Lavochkin
patent: 5960861 (1999-10-01), Price
patent: 6031751 (2000-02-01), Janko
patent: 6111749 (2000-08-01), Lamb et al.
patent: 6125035 (2000-09-01), Hood
patent: 6189213 (2001-02-01), Kimura
patent: 6226178 (2001-05-01), Broder
patent: 6536516 (2003-03-01), Davies et al.
patent: 6580609 (2003-06-01), Pautsch
patent: 6591898 (2003-07-01), Chu et al.
patent: 6661658 (2003-12-01), Capriz
patent: 6665184 (2003-12-01), Akselband
patent: 6711017 (2004-03-01), Kurokawa
patent: 6802366 (2004-10-01), Dillon
patent: 6853555 (2005-02-01), Fichera
patent: 6918437 (2005-07-01), Eytcheson
patent: 6989991 (2006-01-01), Barson
patent: 2003/0128508 (2003-07-01), Faneuf et al.
patent: 2005/0115701 (2005-06-01), Martin et al.
patent: 2005/0189098 (2005-09-01), Wisniewski et al.
patent: 2006/0096738 (2006-05-01), Kang et al.

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