Cooling apparatus for electronic device

Details Cooling apparatus for electronic device Cooling apparatus for electronic device

2000-01-12

2001-05-15

Ramirez, Nestor (Department: 2834)

Electrical generator or motor structure

Dynamoelectric

Reciprocating

C310S016000, C417S413100

Reexamination Certificate

active

06232680

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an apparatus for cooling a heat source in an electronic device by making air flow therein.
2. Description of the Related Art
In general, electronic devices such as a computer include an IC chip, for example, a central processing unit (CPU). The CPU is mounted on a printed circuit board (PCB) and driven by being electrically connected to a circuit pattern. A semiconductor device such as the CPU dissipates heat as power is consumed during operation thereof. Therefore, to prevent malfunction of the device due to the heat, an apparatus for cooling the device is needed.
FIG. 1
shows a sectional view of a conventional cooling apparatus adopted in an electronic device. Referring to the drawing, the cooling apparatus includes a case
10
, an elastic film
13
installed across space in the case
10
, and a magnet
14
installed at the central portion of the elastic film
13
.
The case
10
includes a frame
11
and a cover member
12
. An aperture
12
a
through which air passes is formed in the cover member
12
. A coil
15
is supported at the edge of the aperture
12
a
. An opening
10
a
through which air passes is formed at the lower surface of the frame
11
.
When current is applied to the coil
15
, the magnet
14
is moved by an interactive electromagnetic force with the coil
15
. The elastic film
13
is deformed according to movement of the magnet
14
and then restored by an elastic restoring force, thereby repeating vibrating actions. When the air in the case
10
flows due to the vibration of the elastic film
13
, the air is injected out of the case
10
through the opening
10
a
. The injected air cools a heat source
20
such as a CPU installed adjacent to the opening
10
a.
However, as the elastic film
13
repeats the vibrating action for a long time, the elastic force of the elastic film
13
is lowered due to fatigue so that the elastic film
13
easily tears or is broken. Also, as the width of vibration of the elastic film
13
is relatively small, the amount of air flow is small and thus the efficiency of cooling is relatively low. Hence, it is a problem that an additional heat sink must be installed.
SUMMARY OF THE INVENTION
To solve the above problem, it is an objective of the present invention to provide an apparatus for cooling an electronic device having an improved structure so that durability and the efficiency of cooling is improved.
Accordingly, to achieve the above objective, there is provided an apparatus for cooling an electronic device which comprises a case where a plurality of air intake/exhaust holes through which air passes are formed, a plate type mobile member installed to vibrate in the case to divide an inner space of the case into an upper space and a lower space, an elastic support film fixed in the case to support the mobile member and having a bulged portion capable of being elastically deformed, and a driving device for vibrating the mobile member. Here, by the vibration of the mobile member, air in the upper and lower spaces of the case is exchanged with outside air through the air intake/exhaust holes so that a heat source is cooled.
It is preferable in the present invention that the apparatus for cooling an electronic device further comprises a heat sink installed between the case and the heat source for cooling heat transferred from the heat source by being exposed to the air flow.
Also, it is preferable in the present invention that at least one of the air intake/exhaust holes is formed at the lower surface of the case and the heat sink is installed to be separated a predetermined distance from the lower surface of the case, so that air flowing through the air intake/exhaust hole of the lower surface cools the heat sink.
Also, it is preferable in the present invention that a pad is further provided between the heat sink and the heat source to absorb impact transferred to the heat source.
Also, it is preferable in the present invention that the driving device comprises a magnet installed on a ceiling or bottom of the case to face the mobile member, and a coil installed at the mobile member to correspond to the magnet, wherein the mobile member vibrates up and down by an interactive electromagnetic force occurring between the coil and the magnet.
To achieve the above objective, there is provided an apparatus for cooling an electronic device which comprises a case where a plurality of air intake/exhaust holes through which air passes are formed, an elastic film installed in the case to be capable of vibrating and dividing inner space of the case into an upper space and a lower space, a driving device for vibrating the mobile member, and a heat sink installed between the case and the heat source for transferring heat from a heat source, wherein, by the vibration of the elastic film, air in the upper and lower spaces of the case is exchanged with outside air through the air intake/exhaust holes so that the heat sink is cooled.


REFERENCES:
patent: 5599174 (1997-02-01), Cook et al.
patent: 47-31203 (2000-05-01), None

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