Plastic article or earthenware shaping or treating: apparatus – Means applying electrical or wave energy directly to work – Radiated energy
Reexamination Certificate
2006-04-25
2006-04-25
Smith, Duane (Department: 1722)
Plastic article or earthenware shaping or treating: apparatus
Means applying electrical or wave energy directly to work
Radiated energy
C062S408000, C062S412000
Reexamination Certificate
active
07033160
ABSTRACT:
A convection cooling technique for selective deposition modeling utilizing a venturi duct to establish a low-pressure port for drawing a second flow of air into the duct. The second flow of air is drawn across a heat generating component in the selective deposition modeling apparatus. A low-pressure zone is established at the low-pressure port sufficient to meet the head loss that results when drawing the second flow across the heat generating component and into the venturi duct. A desired flow rate is achieved at a pressure drop that is greater than that possible by the direct use of a fan. The cooling system is well suited for use in providing steady state cooling of radiation exposure systems used in selective deposition modeling to initiate curing of the layers of dispensed material.
REFERENCES:
patent: 4934920 (1990-06-01), Yamauchi et al.
patent: 4967832 (1990-11-01), Porter
patent: 5136515 (1992-08-01), Helinski
patent: 5204055 (1993-04-01), Sachs et al.
patent: 5216616 (1993-06-01), Masters
patent: 5322651 (1994-06-01), Emmer
patent: 5340433 (1994-08-01), Crump
patent: 5380769 (1995-01-01), Titterington et al.
patent: 5555176 (1996-09-01), Menhennett et al.
patent: 5855836 (1999-01-01), Leyden et al.
patent: 5866058 (1999-02-01), Batchelder et al.
patent: 6133355 (2000-10-01), Leyden et al.
patent: 6253834 (2001-07-01), Sterner
patent: 6259962 (2001-07-01), Gothait
patent: 6576872 (2003-06-01), Bertero
patent: 2002/0016386 (2002-02-01), Napadensky
patent: 0 998 180 (2000-05-01), None
patent: WO 97/11837 (1997-04-01), None
patent: WO 00/11092 (2000-03-01), None
patent: WO 01/26023 (2001-04-01), None
patent: WO 01/68375 (2001-09-01), None
U.S. Appl. No. 09/970,956, filed Oct. 3, 2001, Vamon et al.
U.S. Appl. No. 09/971,247, filed Oct. 3, 2001, Schmidt et al.
U.S. Appl. No. 09/971,337, filed Oct. 3, 2001, Schmidt.
U.S. Appl. No. 10/140,426, filed May 7, 2002, Sherwood.
Article entitled, “A Novel Electronic Cooling Concept,” by R. Ponnappan and J. E. Bean, published at http://asp.nerac.com/caccess/WNDABSM?SESSION=D70816D70816D90033028F&STITEM=0004&A dated May 1, 2002.
Article entitled, “Thermal Management Research Studies, vol. 1. Electronics,” by R. Ponnappan, published at http://asp.nerac.com/caccess/WNDABSM?SESSION=D70816D90033028F&ndn=013036157852 dated May 1, 2002.
Article entitled, “Efficient Cooling of MCT and IGBT Using Venturi Flow,” by P. R. Ponnappan, J. E. Leland, J. E. Beam, G. Fronista, and J. A. Weimer, published at http://asp.nerac.com/caccess/WNDABSM?SESSION=D70816D90033028F&ndn=108062198250 dated May 1, 2002.
Article entitled, “Analysis of Conjugate Heat Transfer in a Venturi-Based Cooling System for High Heat-Flux Sources,” by V. Shanmugasundaram, J.E. Leland, J.E. Beam, and R. Ponnappan, published at http://asp.nerac.com/caccess/WNDABSM?SESSION=D70816D90033028F&ndn=108062195698 dated May 1, 2002.
Article entitled, “Active Cooling of MCT Using Venturi Flow,” by R. Ponnappan, J. E. Leland, W.S. Chang, J.E. Beam, B.T. Nguyen, and J.A. Weimer, published at http://asp.nerac.com/caccess/WNDABSM?SESSION=D70816D90033028F&ndn=108059377165 dated May 1, 2002.
3-D Systems, Inc.
Curry James E.
D'Alessandro Ralph
Luk Emmanuel S.
Smith Duane
LandOfFree
Convection cooling techniques in selective deposition modeling does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Convection cooling techniques in selective deposition modeling, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Convection cooling techniques in selective deposition modeling will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3601130