Controls of ambient environment during wafer drying using...

Details Controls of ambient environment during wafer drying using... Controls of ambient environment during wafer drying using...

2004-04-01

2009-11-10

Barr, Michael (Department: 1792)

Cleaning and liquid contact with solids

Apparatus

With plural means for supplying or applying different fluids...

C134S902000

Reexamination Certificate

active

07614411

ABSTRACT:
A method for processing a substrate is provided which includes generating a fluid meniscus to process the substrate and applying the fluid meniscus to a surface of the substrate. The method further includes reducing evaporation of fluids from a surface in the substrate processing environment.

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