Controlling semiconductor structural warpage in rapid thermal pr

Details Controlling semiconductor structural warpage in rapid thermal pr Controlling semiconductor structural warpage in rapid thermal pr

1996-01-04

1998-12-22

Bowers, Charles

Semiconductor device manufacturing: process

Radiation or energy treatment modifying properties of...

H01L 2166

Patent

active

058519297

ABSTRACT:
A method for correcting the shape of a semiconductor structure. According to the method the shape of a semiconductor structure is initially determined to discern the presence, location and magnitude of structural deformities including warp and bow. Information derived from the topography of the structure is then used to control a heating apparatus. More particularly, individual zones or elements of a multiple zone heating assembly are selectively controlled to direct heat radiation of nonuniform intensities toward different regions of the structure to effect non-isothermal conditions within the structure and thereby reduce deformities that were determined to be present in the structure prior to shape correction.

REFERENCES:
patent: 4694143 (1987-09-01), Nishimura et al.
patent: 4755654 (1988-07-01), Crowley et al.
patent: 4888302 (1989-12-01), Ramesh
patent: 5155336 (1992-10-01), Gronet et al.
patent: 5418885 (1995-05-01), Hauser et al.
patent: 5490728 (1996-02-01), Scheitinger et al.
Wolf, S. and R.N. Tauber, eds. "Silcon Processing for the VLSI Era vol. 1:Process Technology" Lattice Press, Sunset Beach, CA. pp. 56-61.

Affiliated with

Also associated with

Rating

Controlling semiconductor structural warpage in rapid thermal pr does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Controlling semiconductor structural warpage in rapid thermal pr, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Controlling semiconductor structural warpage in rapid thermal pr will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2047385