Controlling cumulative wafer effects

Details Controlling cumulative wafer effects Controlling cumulative wafer effects

2006-06-27

2006-06-27

Gandhi, Jayprakash N. (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S105000, C700S108000, C700S109000, C700S110000, C438S005000, C438S014000, C438S714000

Reexamination Certificate

active

07069103

ABSTRACT:
A method and apparatus provided for controlling cumulative wafer effects. The method comprises processing a workpiece, determining a cumulative effect of the processing on the workpiece and comparing the determined cumulative effect to a reference target value. The method further comprises adjusting a downstream process of the workpiece based on comparing the determined cumulative effect to the reference target value.

REFERENCES:
patent: 3751647 (1973-08-01), Maeder et al.
patent: 5495417 (1996-02-01), Fuduka et al.
patent: 5528510 (1996-06-01), Kraft
patent: 5694325 (1997-12-01), Fukuda et al.
patent: 5822218 (1998-10-01), Moosa et al.
patent: 5923553 (1999-07-01), Yi
patent: 6041270 (2000-03-01), Steffan et al.
patent: 6161054 (2000-12-01), Rosenthal et al.
patent: 6223097 (2001-04-01), Hashimoto et al.
patent: 6298470 (2001-10-01), Breiner et al.
patent: 6456894 (2002-09-01), Nulman
patent: 6587744 (2003-07-01), Stoddard et al.
patent: 6656023 (2003-12-01), Molnar

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