Controlled use of photochemically susceptible chemistries...

Details Controlled use of photochemically susceptible chemistries... Controlled use of photochemically susceptible chemistries...

2006-03-28

2006-03-28

Schillinger, Laura M. (Department: 2813)

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

Reexamination Certificate

active

07018938

ABSTRACT:
Radiant energy may be applied to a photochemically susceptible etching or conditioning solution to enable precise control of the removal of material or alteration of the top surface of a wafer during the fabrication of semiconductor integrated circuits. A particular condition may be detected during the course of photoactivated generation of free radicals or molecular activation to control the further generation of said species by controlling the radiant energy exposure of a wafer.

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Anon, “Metal Etching Process-Uses Spray of Etchant, Oxidixing Solution and Water”, RD 330025, 10/1999.

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