Controlled electroless plating

Details Controlled electroless plating Controlled electroless plating

2007-02-13

2007-02-13

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S622000, C438S508000, C427S443100

Reexamination Certificate

active

10994720

ABSTRACT:
An electroless metal deposition process to make a semiconductor device uses a plating bath solution having a reducing agent. A sample of the bath solution is taken and the pH of the sample is increased. The hydrogen evolved from the sample is measured. The hydrogen evolved is used to determine the concentration of the reducing agent present in the sample. Based on the determined reducing agent concentration, the plating bath solution is modified.

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“Quantitative Analysis of Active Metals and Metal Hydrides via Gas Buret”; Aldrich Technichal Bulletin AL-123; Apr. 1996; 3 pgs.
“Electroless Nickel Plating Bath”; Dionex Web Site; 2003; http://www.dionex.com/en/columns—accessories/ion—exchange/flash/fullflash3216.
U.S. Appl. No. 10/650,002, filed Aug. 27, 2003.

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