Controlled dopant diffusion and metal contamination in thin poly

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257384, 257751, 257916, H01L 21336, H01L 23283

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active

061147362

ABSTRACT:
A MOSFET device is formed on a P- doped semiconductor substrate with an N- well formed therein, with a pair of isolation regions formed in the N- well with a gate oxide layer formed above the N- well. An FET device is formed with source and drain regions within the N-well, and a gate electrode formed above the gate oxide layer aligned with the source and drain regions. The gate electrode comprises a stack of layers. A polysilicon layer is formed on the gate oxide layer. A tungsten nitride dopant barrier layer is formed upon the polysilicon layer having a thickness of from about 5 nm to about 20 nm, and a tungsten silicide layer is formed upon the tungsten nitride layer.

REFERENCES:
patent: 4900257 (1990-02-01), Maeda
patent: 5164333 (1992-11-01), Schwalke et al.
patent: 5319245 (1994-06-01), Chen et al.
patent: 5364803 (1994-11-01), Lur et al.
patent: 5414301 (1995-05-01), Thomas
patent: 5439831 (1995-08-01), Schwalke et al.
patent: 5451545 (1995-09-01), Ramaswami et al.
patent: 5472892 (1995-12-01), Gwen et al.
patent: 5543362 (1996-08-01), Wu
patent: 5604140 (1997-02-01), Byun
patent: 5656519 (1997-08-01), Mogami
patent: 5733816 (1998-03-01), Iyer et al.
patent: 5736455 (1998-04-01), Iyer et al.
patent: 5776823 (1998-07-01), Agnello et al.
Metal Diffusion Barrier Composite in Polycide Process, Research Disclosure, (Mar. 1986) p. 263.

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