Controlled dissolution of quartz

Details Controlled dissolution of quartz Controlled dissolution of quartz

1993-07-06

1995-03-14

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156663, 156637, 65 31, 252 791, 252 795, H01L 2100

Patent

active

053974301

ABSTRACT:
Quartz sections having a surface condition as polished as possible are prepared by controlled dissolution by placing said quartz sections in a bath of a quartz solvent or a mixture of solvents, wherein the bath is basic and comprises an alkaline hydroxide or fluoride, or ammonium hydroxide, or a mixture of these compounds; and conducting controlled dissolution of the quartz sections at atmospheric pressure.

REFERENCES:
patent: 4915870 (1990-04-01), Jones
Chemical Abstracts, vol. 98, 1983, Columbus, Ohio, US; Abstract No. 153771A, "Quartz Oscillators" Colonne 1; & JP-A-57 176 815 (Citizen Watch Co., Ltd.) 30 Oct. 1982.
Chemical Abstracts, vol., 112, No. 67, 1990, Columbus, Ohio, US; A. S. Sandhu et al: "Effect of Nature of the Etchant on Anisotropic Track Etching in Quartz" *Abrege* & Indian Journal of Pure Applied Physics vol. 28, No. 2, 1990, Dev. University, Amritsar, India. pp. 73-75.
Proceedings of the 39:th Annual Frequency Symp. 1985, IEEE Cat. No. 85ch2186-5, pp. 271-275. Library of Congress No. 58-60781, 29-31 May 1985 A. J. Bernot,; "Etching Study of At-Cut Cultured o; Quartz Using Etchants Containing Fluoride Salts, Hydrofluoric Acid, and Ammonium Bifluoride".
"Solubility of Quartz in Ammonium Fluoride Aqueous Solutions"; Safronov et. al; abstract only; 1972; IZV. Akad. Nauk SSSR, Neorg. Mater; 8(2).
"Dissolution and Crystallization of Quartz Under Hydrothermal Conditions"; Ganeer et. al.; 1971; abstract only; IZV. Akad. Nauk SSSR, Neorg Mater., 7(5).
"Study of the Surface Structure of Quartz Fibers by IR Fourier Transform Spectroscopy"; abstract only; Arutyunyan et. al.; 1983; Kolloidn, Zh. 45(2).

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