Control of parallelism during semiconductor die attach

Details Control of parallelism during semiconductor die attach Control of parallelism during semiconductor die attach

1996-12-06

2000-05-09

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1563077, H05K 1304

Patent

active

060599170

ABSTRACT:
The invention is to a mounting device (12) and to a method of mounting a semiconductor die (11) to a mounting surface (10) to ensure that the die (11) is in a plane parallel to the mounting surface (10). An intermediate woven mounting device (12) having two parallel faces and having a plurality of co-planer mounting points (13a and 14a) on each of the parallel faces is placed on a semiconductor mounting surface (10) and the semiconductor die (11) is placed on the intermediate device. Along with a die attach adhesive, heat and pressure is applied to secure the semiconductor die (11) and intermediate mounting device (12) to the mounting surface (10).

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