Control of chemical-mechanical polishing rate across a substrate

Abrading – Abrading process – Glass or stone abrading

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Details

451296, 451303, 451287, B35B 100, B35B 719

Patent

active

059160128

ABSTRACT:
A technique for controlling a polishing rate across a substrate surface when performing CMP, in order to obtain uniform polishing of the substrate surface. A support housing which underlies a polishing pad includes a plurality of openings for dispensing a pressurized fluid. The openings are arranged into a pre-configured pattern for dispensing the fluid to the underside of the pad opposite the substrate surface being polished. The openings are configured into a number of groupings, in which a separate channel is used for each grouping so that fluid pressure for each group of openings can be separately and independently controlled.

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