Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1980-10-15
1983-02-01
Ives, P.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156642, 1566591, 156901, 156902, 156345, H01L 21306, C23F 102
Patent
active
043714226
ABSTRACT:
Disclosed is the continuous processing of flat workpieces such as printed circuit boards which are suspended by a hanger conveyorized for continuous horizontal transport. More specifically, the conveyorizing passes the workpieces through a plurality of chambers having slotted-end members, one such chamber spraying to remove the photoresist, and another such chamber spraying etching solution to remove the copper cladding. Each station has a slotted cover, and the conveyor suspends a plurality of workpiece holders, each of the holders being joined by chain links of an inert material which overlie the slot in the covers for the chambers. The photoresist chamber is provided with a continuous filter for continuously removing and filtering the sludge, thereby reducing the tendency of the removal solution to dilute and become ineffective. All of the chambers are modularized, and the system is compatible with continuous processing for the plating of the printed circuit boards.
The method shown essentially provides for the continuous processing of printed circuit boards for the removal of photoresist and copper cladding, the sequence being variable. In addition, the printed circuit boards are constrained against lateral sway by providing a plurality of wires pitched steadily downwardly along the path of motion.
REFERENCES:
patent: 1908487 (1933-05-01), Powers
patent: 3615957 (1971-10-01), Konstantouros
patent: 3795561 (1974-03-01), Bond et al.
patent: 4252621 (1981-02-01), Reinhardt et al.
Dominik Jack E.
Ives P.
Micro-Plate Inc.
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