Continuous process for producing solder bumps on electrodes of s

Details Continuous process for producing solder bumps on electrodes of s Continuous process for producing solder bumps on electrodes of s

1998-03-10

2000-11-28

Bowers, Charles

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

H01L 2144

Patent

active

061535036

ABSTRACT:
A process for producing solder bumps on metal electrodes, such as Al electrodes, of a semiconductor wafer, such as silicon wafer, involves the formation of the under bump metallurgies (UBM) on the electrodes. The solder bumps are then formed on the under bump metallurgies by wave soldering. The under bump metallurgies consist of a diffusion barrier layer formed on the metal electrodes, and a wetting layer formed on the diffusion barrier layer.

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