Continuous highly conductive metal wiring structures and method

Details Continuous highly conductive metal wiring structures and method Continuous highly conductive metal wiring structures and method

1997-04-03

1999-07-27

Chaudhuri, Olik

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438633, 438637, 438641, 438648, 438661, H01L 2100

Patent

active

059306696

ABSTRACT:
The present relates to a method of fabricating wiring structures which contain a continuous, single crystalline conductive material extending through the structure. This is achieved in the present invention by utilizing an open-bottomed via liner structure.

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