Continuous feed chemical vapor deposition

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Fluid growth from gaseous state combined with subsequent...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21090, C118S718000

Reexamination Certificate

active

08008174

ABSTRACT:
Embodiments of the invention generally relate to a method for forming a multi-layered material during a continuous chemical vapor deposition (CVD) process. In one embodiment, a method for forming a multi-layered material during a continuous CVD process is provided which includes continuously advancing a plurality of wafers through a deposition system having at least four deposition zones. Multiple layers of materials are deposited on each wafer, such that one layer is deposited at each deposition zone. The methods provide advancing each wafer through each deposition zone while depositing a first layer from the first deposition zone, a second layer from the second deposition zone, a third layer from the third deposition zone, and a fourth layer from the fourth deposition zone. Embodiments described herein may be utilized to form an assortment of materials on wafers or substrates, especially for forming Group III/V materials on GaAs wafers.

REFERENCES:
patent: 3993533 (1976-11-01), Milnes et al.
patent: 4445965 (1984-05-01), Milnes
patent: 4727047 (1988-02-01), Bozler et al.
patent: 4846931 (1989-07-01), Gmitter et al.
patent: 4883561 (1989-11-01), Gmitter et al.
patent: 5073230 (1991-12-01), Maracas et al.
patent: 5122852 (1992-06-01), Chang et al.
patent: 5201996 (1993-04-01), Gmitter et al.
patent: 5221637 (1993-06-01), De Boeck
patent: 5256562 (1993-10-01), Vu et al.
patent: 5258325 (1993-11-01), Spitzer et al.
patent: 5276345 (1994-01-01), Siegel et al.
patent: 5277749 (1994-01-01), Griffith et al.
patent: 5286335 (1994-02-01), Drabik et al.
patent: 5344517 (1994-09-01), Houlding
patent: 5401983 (1995-03-01), Jokerst et al.
patent: 5411592 (1995-05-01), Ovshinsky et al.
patent: 5458694 (1995-10-01), Nuyen
patent: 5465009 (1995-11-01), Drabik et al.
patent: 5476810 (1995-12-01), Curran
patent: 5479043 (1995-12-01), Nuyen
patent: 5528719 (1996-06-01), Yamada
patent: 5546375 (1996-08-01), Shimada et al.
patent: 5641381 (1997-06-01), Bailey et al.
patent: 5827751 (1998-10-01), Nuyen
patent: 5985742 (1999-11-01), Henley et al.
patent: 6010579 (2000-01-01), Henley et al.
patent: 6071795 (2000-06-01), Cheung et al.
patent: 6155909 (2000-12-01), Henley et al.
patent: 6214733 (2001-04-01), Sickmiller
patent: 6221740 (2001-04-01), Bryan et al.
patent: 6232136 (2001-05-01), Zavracky et al.
patent: 6263941 (2001-07-01), Bryan et al.
patent: 6284631 (2001-09-01), Henley et al.
patent: 6287891 (2001-09-01), Sayyah
patent: 6290804 (2001-09-01), Henley et al.
patent: 6291313 (2001-09-01), Henley et al.
patent: 6294814 (2001-09-01), Henley et al.
patent: 6346459 (2002-02-01), Usenko et al.
patent: 6352909 (2002-03-01), Usenko
patent: 6387829 (2002-05-01), Usenko et al.
patent: 6391740 (2002-05-01), Cheung et al.
patent: 6414783 (2002-07-01), Zavracky et al.
patent: 6458672 (2002-10-01), Henley et al.
patent: 6486041 (2002-11-01), Henley et al.
patent: 6500732 (2002-12-01), Henley et al.
patent: 6504524 (2003-01-01), Gates et al.
patent: 6511899 (2003-01-01), Henley et al.
patent: 6513564 (2003-02-01), Bryan et al.
patent: 6528391 (2003-03-01), Henley et al.
patent: 6548382 (2003-04-01), Henley et al.
patent: 6554046 (2003-04-01), Bryan et al.
patent: 6559075 (2003-05-01), Kelly et al.
patent: 6589811 (2003-07-01), Sayyah
patent: 6632724 (2003-10-01), Henley et al.
patent: 6669801 (2003-12-01), Yoshimura et al.
patent: 6677249 (2004-01-01), Laermer et al.
patent: 6740604 (2004-05-01), Kelly et al.
patent: 6790747 (2004-09-01), Henley et al.
patent: 6809044 (2004-10-01), Aspar et al.
patent: 6890838 (2005-05-01), Henley et al.
patent: 6943050 (2005-09-01), Kondo
patent: 6974521 (2005-12-01), Schermer
patent: 7045878 (2006-05-01), Faris
patent: 7056808 (2006-06-01), Henley et al.
patent: 7060591 (2006-06-01), Yamazaki et al.
patent: 7153761 (2006-12-01), Nastasi et al.
patent: 7160790 (2007-01-01), Henley et al.
patent: 7163826 (2007-01-01), Faris
patent: 7198671 (2007-04-01), Ueda
patent: 7202141 (2007-04-01), Park et al.
patent: 7229901 (2007-06-01), Savage et al.
patent: 7241667 (2007-07-01), Park et al.
patent: 7341925 (2008-03-01), Kelly et al.
patent: 7348258 (2008-03-01), Henley et al.
patent: 7638410 (2009-12-01), Nastasi et al.
patent: 2006/0024442 (2006-02-01), Ovshinsky
patent: 2006/0073276 (2006-04-01), Antonissen
patent: 2007/0068559 (2007-03-01), Brody
patent: 2009/0321881 (2009-12-01), Archer et al.
patent: 2009/0321885 (2009-12-01), Archer et al.
patent: 2009/0321886 (2009-12-01), Gmitter et al.
patent: 2009/0324379 (2009-12-01), He et al.
patent: 2009/0325367 (2009-12-01), He et al.
patent: 2010/0001316 (2010-01-01), Gmitter et al.
patent: 2010/0001374 (2010-01-01), Gmitter et al.
patent: WO-2006131316 (2006-12-01), None
Bauhuis, G.J., “Substrate Reuse for Epitaxial Lift-Off of III-V Solar Cells”, Proceedings of the 22nd European Photovoltaic Solar Energy Conference: Milan, Sep. 3-7, 2007, pp. 106-110.
Bauhuis, G.J., “Thin film GaAs solar cells with increased quantum efficiency due to light reflection”, Solar Energy Materials & Solar Cells 83 (2004) 81-90, Nov. 3, 2003.
Konagai, Makoto, “High Efficiency GaAs Thin Film Solar Cells by Peeled Film Technology”, Journal of Crystal Growth 45 (1978) 277-280.
Kumar, P., “Sacrificial etching of AlxGa1-xAs for III-V MEMS surface micromachining”, Appl. Phys. A 88, 711-714, May 24, 2007.
Schermer J.J., “Epitaxial Lift-Off for large area thin film III/V devices”, Phys. Stat. Sol. (1) 202, No. 4, 501-508 (2005).
Schermer, J.J., “Photon confinement in high-efficiency, thin-film III-V solar cells obtained by epitaxial lift-off”, Thin Solid Films 511-512 (2006) 645-653, Jan. 19, 2006.
Schermer, J.J., “Thin-film GaAs Epitaxial Lift-Off Solar Cells for Space Applications”, Prog. Photovolt: Res. Appl. 2005; 13:587-596, Apr. 28, 2005.
Schermer, John, “Solar Cells Based on III-V Semiconductors”, Joint Solar Panel, Sep. 29, 2004.
Sickmiller, Mike, “Packaging of Ultrathin Semiconductor Devices Through the ELO Packaging Process”, Mat. Res. Soc. Symp. Proc. vol. 681E (2001).
van Deelen, J. “On the development of high-efficiency thin-film GaAs and GaInP2 cells”, Journal of Cyrstal Growth 298 (2007) 772-776, Nov. 28, 2006.
van Niftrik, A. T. J., “HF Species and Dissolved Oxygen on the Epitaxial Lift-Off Process of GaAs Using AlAsP Release Layers”, Journal of the Electrochemical Society, 155 (1) D35-D39 (2008), Nov. 6, 2007.
van Niftrik, A.T.J., “A Diffusion and Reaction Related Model of the Epitaxial Lift-Off Process”, Journal of the Electrochemical Society, 154 (11) D629-D635 (2007), Sep. 19, 2007.
van Niftrik, Antonius T. J., “The Influence of InxGa1-xAs and GaAs1-yPyLayers Surrounding the AlAs Release Layer in the Epitaxial Lift-Off Process”, Crystal Growth & Design, 2007, vol. 7, No. 12, 2472-2480, Aug. 7, 2007.
Voncken, M.M.A.J., “Strain-accelerated HF etching of AlAs for epitaxial lift-off”, J. Phys.: Condens. Matter 16 (2004) 3585-3596, May 14, 2004.
Voncken, M.M.A.J., “Influence of radius of curvature on the lateral etch rate of the weight induced epitaxial lift-off process”, Material Science and Engineering B95 (2002) 242-248, May 21, 2002.
Voncken, M.M.A.J., “Multiple release layer study of the intrinsic lateral etch rate of the epitaxial lift-off process”, Appl. Phys. A 79, 1801-1807, Mar. 28, 2003.
Yablonovitch, E., “Van De Waals bonding of GaAs epitaxial liftoff films onto arbitrary substrates”, Appl. Phys. Lett. 56 (24), Jun. 11, 1990.
PCT International Search Report and Written Opinion dated May 18, 2010 for International Application No. PCT/US2009/060372.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Continuous feed chemical vapor deposition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Continuous feed chemical vapor deposition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Continuous feed chemical vapor deposition will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2642321

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.