Special receptacle or package – For a building component – Shingle
Patent
1978-08-17
1980-04-29
Ross, Herbert F.
Special receptacle or package
For a building component
Shingle
206330, B65D 7302
Patent
active
042001919
ABSTRACT:
A container for semiconductor chips is disclosed. The container includes an annular ring having a first diameter and an annular lower casing having a second diameter, greater than the first diameter. The annular lower container houses the annular ring. A plastic film, holding the semiconductor chips, is stretched over an annular opening in the annular ring. An upper container mates with the lower container to form an air-tight housing for the annular ring. The upper container is shaped in such a manner that the upper container fixes the annular ring in place but does not contact the semiconductor chip.
REFERENCES:
patent: 3615006 (1971-10-01), Freed
patent: 3719273 (1973-03-01), Abe
patent: 4091919 (1978-05-01), MacLeod et al.
Abe Takaharu
Nakamura Yoshiaki
Nippon Electric Company Ltd.
Ross Herbert F.
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