Contactless technique for evaluating a fabrication of a wafer

Details Contactless technique for evaluating a fabrication of a wafer Contactless technique for evaluating a fabrication of a wafer

2004-08-25

2010-06-01

Do, Thuan (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C702S127000, C702S134000, C702S172000

Reexamination Certificate

active

07730434

ABSTRACT:
The fabrication of the wafer may be analyzed starting from when the wafer is in a partially fabricated state. The value of a specified performance parameter may be determined at a plurality of locations on an active area of a die of the wafer. The specified performance parameter is known to be indicative of a particular fabrication process in the fabrication. Evaluation information may then be obtained based on a variance of the value of the performance parameter at the plurality of locations. This may be done without affecting a usability of a chip that is created from the die. The evaluation information may be used to evaluate how one or more processes that include the particular fabrication process that was indicated by the performance parameter value was performed.

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