Contact temperature probe with unrestrained orientation

Thermal measuring and testing – Housing – support – or adjunct

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Details

374163, G01K 100, G01K 700

Patent

active

057917825

ABSTRACT:
A combination contact temperature probe/wafer support includes a thermocouple enclosing probe head of low thermal mass and large contact area supported by a support means such that 1) there is a high thermal resistivity connection between the support means and the probe head, and 2) the probe head is self orienting under the weight of the wafer so that the contact area is maintained coplanar with the surface of the wafer.

REFERENCES:
patent: 2736784 (1956-02-01), Gore
patent: 4081291 (1978-03-01), English et al.
patent: 4355911 (1982-10-01), Tymkewicz
patent: 4416553 (1983-11-01), Huebscher
patent: 4886371 (1989-12-01), Fondin
patent: 5356486 (1994-10-01), Sugarman et al.

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