Contact structure between two conductive layers in semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257384, 257639, 257649, 257755, 257766, H01L 2976, H01L 2994, H01L 31062

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active

056147457

ABSTRACT:
A semiconductor device has a contact structure between two conductive layers capable of effectively preventing growth of an oxide film and diffusion of impurities between an impurity diffused region in a first one of the conductive layers and a polycrystalline silicon film (the second conductive layer) formed to be in contact with the impurity diffused region. The contact structure between the two conductive layers includes an n-type impurity diffused region 3 formed on a silicon substrate 1, an nitrided oxide film 4 formed to be in contact with the n-type impurity diffused region 3, and a polycrystalline silicon film 5a formed on the nitrided oxide film 4 and doped with impurities. Accordingly, growth of an oxide film and diffusion of impurities between the n-type impurity diffused region 3 and the polycrystalline silicon film 5a are also effectively prevented in a case where heat treatment at a high temperature is subsequently carried out in an oxygen atmosphere.

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patent: 5150179 (1992-09-01), Gill
Chang et al., "Specific Contact Resistance of Metal-Semiconductor Barriers", Solid-State Electronics Pergamon Press 1971, vol. 14, pp. 541-550.
Hideaki Arima et al., Japanese Journal of Applied Physics, vol. 30, No. 3A, 1991, pp. L 334 to 337.
Hyunsang Hwang et al., Appl. Phys. Lett. 57(10), 1990, pp. 1010 to 1011.
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Manabu Ando et al., IEEE Journal of Solid-State Circuits, vol. 24, No. 6, 1989, pp. 1708 to 1713.
B.E. Deal, "Vapor Phase Wafer Cleaning and Integrated Processing Technology for the 1990's" 1990 Proceedings--Institute of Environmental Sciences. pp. 1-6.

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