Contact portion of semiconductor device, and thin film...

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material

Reexamination Certificate

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C438S149000, C257SE27116

Reexamination Certificate

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07737445

ABSTRACT:
A method for manufacturing a semiconductor device including forming a first wire on a substrate, forming a lower film on the first wire, forming a photosensitive pattern on the lower film using a photosensitive material, forming contact holes for exposing the first wire by etching the lower film using the photosensitive film as an etching mask, removing part of the photosensitive film pattern by an ashing process to expose a borderline of the lower film defining the contact holes and forming second wire connected to the first wire via the contact holes.

REFERENCES:
patent: 5432108 (1995-07-01), Lee
patent: 5784131 (1998-07-01), Kim et al.
patent: 6001539 (1999-12-01), Lyu et al.
patent: 6088071 (2000-07-01), Yamamoto et al.
patent: 6207971 (2001-03-01), Jinno et al.
patent: 6228747 (2001-05-01), Joyner
patent: 6307611 (2001-10-01), Kim et al.
patent: 6338989 (2002-01-01), Ahn et al.
patent: 6620655 (2003-09-01), Ha et al.
patent: 6674495 (2004-01-01), Hong et al.
patent: 2001/0032981 (2001-10-01), Kong et al.
patent: 1290922 (2001-04-01), None
patent: 02028923 (1990-01-01), None
patent: 03042871 (1991-02-01), None
patent: 03265168 (1991-11-01), None
patent: 08107143 (1996-04-01), None
patent: 9-8131 (1997-01-01), None
patent: 10041519 (1998-02-01), None
patent: 10092926 (1998-04-01), None
patent: 11-153808 (1999-06-01), None
patent: 2000-183040 (2000-06-01), None
patent: 2000347173 (2000-12-01), None
patent: 2001-033826 (2001-02-01), None
patent: 2001-230321 (2001-08-01), None
patent: 8-78523 (2008-02-01), None
patent: 10-2001-0016713 (2001-03-01), None

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