Contact pads for silicon chip packages

Details Contact pads for silicon chip packages Contact pads for silicon chip packages

2008-06-04

2011-12-27

Garber, Charles (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S117000, C438S613000, C438S614000, C438S615000, C438S650000, C438S652000, C438S642000, C438S678000, C438S686000, C438S761000, C257SE21476, C257SE21509

Reexamination Certificate

active

08084348

ABSTRACT:
A method for manufacturing a silicon chip package for a circuit board assembly provides a package with a silicon chip and an array of first contact pads that are provided by a first conductive material. A plurality of second contact pads are provided from a gold material having a hardness different than that of the first contact pads. The second contact pads are soldered to the first contact pads of the package. A circuit board assembly is assembled by providing a circuit board substrate with at least one socket with contact pads. The second contact pads of the package are assembled to the circuit board substrate contact pads.

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