Data processing: measuring – calibrating – or testing – Measurement system – Measured signal processing
Reexamination Certificate
2005-07-12
2005-07-12
Wachsman, Hal (Department: 2857)
Data processing: measuring, calibrating, or testing
Measurement system
Measured signal processing
C702S155000, C702S170000, C430S030000
Reexamination Certificate
active
06917901
ABSTRACT:
A method uses three dimensional feature metrology for implementation of critical image control and feedback of lithographic focus and x/y tilt. The method is for measuring 3 dimensional profile changes in a photo sensitive film and feeding back compensatory exposure tool focus corrections to maintain a stable lithographic process. The measured focus change from the optimal tool focus offset is monitored directly on the critical product images for both contact hole and line images. Z Focus corrections and x/y tilt corrections are fed back independently of dose to maintain critical dimension (CD) control thereby achieving improved semiconductor wafer printing. Additionally, the method can be used to diagnose problems with the focusing system by measuring the relationship between line edge width and barometric pressure.
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Su et al., “Sidewall angle measurements using CD SEM”, Sep. 23-25, 1998, IEEE, Advanced Semiconductor Manufacturing Conference and Workshop, pp. 259-261.
Bowley, Jr. Reginald R.
Carlos Vincent J.
Doran James E.
Knight Stephen E.
Leidy Robert K.
International Business Machines - Corporation
Sabo, Esq. William D.
Scully Scott Murphy & Presser
Wachsman Hal
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