Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2009-03-11
2010-06-15
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE29064
Reexamination Certificate
active
07737022
ABSTRACT:
The present disclosure includes various method, circuit, device, and system embodiments. One such method embodiment includes creating a trench in an insulator stack material having a portion of the trench positioned between two of a number of gates and depositing a spacer material to at least one side surface of the trench. This method also includes depositing a conductive material into the trench and depositing a cap material into the trench.
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International Search Report (8 pgs).
Manning H. Montgomery
Mathew James
Brooks Cameron & Huebsch PLLC
Le Thao P.
Micro)n Technology, Inc.
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