Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-03-11
1988-07-19
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156644, 156646, 156653, 156657, 1566611, 156668, 156904, 252 791, 427 431, 430312, 430313, 430317, B44C 122, B29C 3700, C03C 1500, C03C 2506
Patent
active
047583053
ABSTRACT:
A method for patterning small-geometry contacts with sloped sidewalls in integrated circuit fabrication. A multilayer resist process is used, and the spacer layer is undercut by overexposure and overdevelopment at the pattern transfer stage. This provides a cantilever etch mask structure, without the need to use any hardmask layers.
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patent: 4557797 (1985-12-01), Fuller et al.
Lin et al., Some Aspects of Anti-Reflective Coating for Optical Lithography, SPIE vol. 469, Advances in Resist Tech. (1984), pp. 30-34, 36 and 37.
Lin et al., Use of Anti-Reflective Coating in Bilayer Resist Process, 1983, International Symposium on Electron, Ion and Photon Beams, May 31-Jun 3, 1983.
Saia et al., Dry Etching of Tapered Contact Holes using Multilayer Resist, J. Electrochem, Soc. Solid-State Science & Tech. Aug. 1985, pp. 1954-1957, vol. 132, No. 8.
Reynolds et al., Studies of Plasma Etching Mechanisms with Cantilever, Electronics Research Lab., University of California, pp. 61-74.
Bonifield et al., Sloped Contact Ething, Plasma Seminar Proceedings 1985, pp 25-29.
Rothman et al., Process for Forming Tapered Vias In SiO.sub.2 by Reactive ION Etching, IBM Data Systems Division, pp. 193-198.
Bonifield Thomas D.
Douglas Monte A.
Jucha Rhett B.
Marriott Vic B.
Groover III Robert
Powell William A.
Texas Instruments Incorporated
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