Construction of thin strain-relaxed SiGe layers and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – With lattice constant mismatch

Reexamination Certificate

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C257SE21125

Reexamination Certificate

active

10915362

ABSTRACT:
A construction of thin strain-relaxed SiGe layers and method for fabricating the same is provided. The construction includes a semiconductor substrate, a SiGe buffer layer formed on the semiconductor substrate, a Si(C) layer formed on the SiGe buffer layer, and an relaxed SiGe epitaxial layer formed on the Si(C) layer. The Si(C) layer is employed to change the strain-relaxed mechanism of the relaxed SiGe epitaxial layer formed on the Si(C) layer. Therefore, a thin relaxed SiGe epitaxial layer with low threading dislocation density, smooth surface is available. The fabricating time for fabricating the strain-relaxed SiGe layers is greatly reduced and the surface roughness is also improved.

REFERENCES:
patent: 5221413 (1993-06-01), Brasen et al.
patent: 6291321 (2001-09-01), Fitzgerald
patent: 6660393 (2003-12-01), Saitoh et al.
patent: 2003/0107032 (2003-06-01), Yoshida

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