Constituent members of a semiconductor element-manufacturing app

Details Constituent members of a semiconductor element-manufacturing app Constituent members of a semiconductor element-manufacturing app

1985-02-11

1986-11-25

Bernstein, Hiram H.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

427 93, 156DIG83, 423345, C30B 3500

Patent

active

046247351

ABSTRACT:
The constituent members of a semiconductor element-manufacturing apparatus which are formed by depositing a silicon carbide layer on a carbon substrate, and wherein a peak X-ray diffraction on the (200) plane of the silicon carbide layer has a half value width of 0.35.degree. or less as measured by the C.sub.u --K.sub..alpha. ray used in the X-ray diffraction analysis.

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