Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2007-04-24
2007-04-24
Smith, Matthew (Department: 2823)
Semiconductor device manufacturing: process
With measuring or testing
C439S572000
Reexamination Certificate
active
10865353
ABSTRACT:
In a side plate (52) of a retainer (50), a jig insertion groove (70) is cut at an upper end portion of its front edge. A releasing jig (J) is insertable into a gap between the bottom surface of the jig insertion groove (70) and a vertical front edge of a recessed surface (27) of a female housing (20). If the releasing jig (J) is rotated so as to be pried, the retainer (50) is pushed back diagonally downward along a guide groove (60) and reaches a temporary retaining position.
REFERENCES:
patent: 4973268 (1990-11-01), Smith et al.
patent: 5061210 (1991-10-01), Jinno
patent: 5378176 (1995-01-01), Sasai
patent: 5562500 (1996-10-01), Tsukakoshi
patent: 5651703 (1997-07-01), Sasai
patent: 6019645 (2000-02-01), Avery et al.
patent: 6139375 (2000-10-01), Konoya et al.
patent: 6645015 (2003-11-01), Mase et al.
patent: 6702627 (2004-03-01), Nankou et al.
Fukatsu Yukihiro
Kida Yoshiaki
Sakurai Toshikazu
Shinmura Masaru
Suda Satoshi
Casella Anthony J.
Hespos Gerald E.
Honda Motor Co. Ltd.
Nguyen Khiem
Smith Matthew
LandOfFree
Connector does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Connector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connector will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3749461