Connection structure of circuit substrate

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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Details

C439S885000

Reexamination Certificate

active

07371071

ABSTRACT:
The present invention provides an improved connection for circuit substrates. The circuit substrates are connected at concave and convex portions at their ends. The concave portion is formed such that the inside width is larger than the entrance width. The convex portion fits into the concave portion. Thereby, a connected portion of the circuit substrates has increased tensile strength. Furthermore, abnormality of the connected portion of the circuit substrates may be easily perceived.

REFERENCES:
patent: 5110298 (1992-05-01), Dorinski et al.
patent: 5854741 (1998-12-01), Shim et al.
patent: 739828 (1954-02-01), None
patent: 06-156562 (1994-03-01), None
patent: 7-165260 (1995-06-01), None
patent: 09-012228 (1997-01-01), None
patent: 09-191021 (1997-07-01), None
patent: 2000-126665 (2000-05-01), None
patent: 1998-020175 (1998-06-01), None
patent: 1020010097634 (2001-11-01), None
patent: 20-0271836 (2002-03-01), None
patent: 1020020066820 (2002-08-01), None
English language abstract of Japanese Publication No. 06-156562.
English language abstract of Japanese Publication No. 09-012228.
English language abstract of Japanese Publication No. 09-191021.
English language abstract of Japanese Publication No. 2000-126665.
English language abstract of Korean Publication No. 1020010097634.
English language abstract of Korean Publication No. 1020020066820.
English language abstract of Korean Publication No. 1998-020175.
English language abstract of Korean Publication No. 20-0271836.
English language abstract of Japanese Publication No. 7-165260.

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