Patent
1982-06-22
1985-07-16
James, Andrew J.
357 75, 357 70, H01L 2348, H01L 2350
Patent
active
045300020
ABSTRACT:
A semiconductor device having improved construction of connection leads extending from the chip carrier housing for connecting a semiconductor chip in the housing with the external circuitry. The connection leads are arranged in the form of a plurality of concentric arrays. The leads in the outermost array are composed of surface connection leads to be electrically connected to the uppermost layer of a multilayer printed board to which the semiconductor device will be mounted, and the leads in the inner array or arrays are composed of lead pins to be inserted into and be electrically connected to the through holes of the multilayer printed board.
REFERENCES:
patent: 4142203 (1979-02-01), Dietz
patent: 4150421 (1979-04-01), Nishihara et al.
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4296456 (1981-10-01), Reid
patent: 4322778 (1982-03-01), Barbour et al.
"Personalized Prepackaged Semiconductor Devices" Chang et al.-IBM Technical Disclosure Bulletin, vol. 17, No. 7, Dec. 1974, p. 1950.
"Heat Dissipation from IC Chips through Module Package" Balderes et al., IBM Technical Disclosure Bulletin, vol. 19, No. 11, Apr. 1977, p. 4165.
"Microcircuit Having Pinned Terminals"-Cochran et al.-IBM Disclosure Bulletin, vol. 8, No. 11, Apr. 1966, pp. 1483-1484.
Clark Sheila V.
Fujitsu Ltd.
James Andrew J.
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