Connection for off-chip electrostatic discharge protection

Details Connection for off-chip electrostatic discharge protection Connection for off-chip electrostatic discharge protection

2009-10-05

2011-11-08

Toledo, Fernando L (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S672000, C257S173000, C257SE21499, C257SE23141, C438S014000, C438S110000, C438S010000, C438S011000, C438S012000

Reexamination Certificate

active

08053898

ABSTRACT:
A method and apparatus for off-chip ESD protection, the apparatus includes an unprotected IC22stacked on an ESD protection chip24and employing combinations of edge wrap32and through-silicon via connectors44for electrical connection from an external connection lead34on a chip carrier84or system substrate64, to an ESD protection circuit, and to an I/O trace46of the unprotected IC22. In one embodiment the invention provides an ESD-protected stack50of unprotected IC chips52, 54that has reduced hazard of mechanical and ESD-damage in subsequent handling for assembly and packaging. The method includes a manufacturing method170for mass producing embedded edge wrap connectors32, 38during the chip manufacturing process.

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