Connection component and method of making same

Details Connection component and method of making same Connection component and method of making same

1999-09-15

2001-10-23

Zarabian, Amir (Department: 2824)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S611000, C438S613000, C438S691000, C438S754000, C216S014000, C216S052000, C216S053000, C216S056000

Reexamination Certificate

active

06306752

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to semiconductor chip packages and more specifically to connection components for use in semiconductor chip packages.
2. Description of the Related Art
Connection components are frequently used to make semiconductor chip packages. Certain semiconductor chip packages are made by bonding the contacts on the chip to leads on the connection component. Such semiconductor chip packages include packages made using tape automated bonding techniques wherein the connection component is a copper clad polyimide tape. Other semiconductor chip packages made with connection components include certain chip scale packages which are made by bonding the chip to a flexible interposer such as those disclosed in commonly assigned U.S. Pat. Nos. 5,148,265 and 5,148,266, the disclosures of which are hereby incorporated herein by reference.
One of the problems associated with the use of such tape or chip carriers is the high cost of processing the polyimide. The cost of the gold that is plated onto such carriers also contributes to the high cost of such chip carriers. It is desirable, therefore, to reduce the cost of the chip carrier by eliminating the use of sheets of polyimide and by significantly decreasing the amount of gold used.
SUMMARY OF THE INVENTION
One aspect of the present invention provides a method of making a connection component for use in packaging a microelectronic element such as a semiconductor chip or wafer. The method of this aspect of the invention includes the step of providing a composite sheet comprising a photoresist layer, an electrically conductive layer and a photoimageable dielectric layer. Portions of the photoresist layer are exposed to ultraviolet light and the photoresist layer is then developed to uncover selected portions of the conductive layer. The uncovered portions are etched to form leads and other conductive elements. The remaining photoresist layer is removed. Apertures are formed in the photoimageable dielectric layer using photolithographic techniques whereby portions of the photoimageable dielectric layer are exposed to ultraviolet light. The photoimageable dielectric layer is then developed, usually by immersing such layer in or spraying such layer with a development solution and dissolving away either the light-exposed or the unexposed portions.
In preferred embodiments, the connection component made by the method of this aspect of the present invention includes a photoimageable dielectric layer having a plurality of apertures and a plurality of electrically conductive leads disposed on such photoimageable dielectric layer. This connection component may be used to package a semiconductor chip by juxtaposing the chip with the connection component such that each chip contact is aligned with the tip of one of the leads. In preferred embodiments, the apertures include bond windows and holes for solder balls; and a least a portion of each lead is disposed over one of the bond windows. The chip contacts are then bonded to the leads, preferably by inserting a bonding tool through the bond window. The assembly may then be encapsulated. In preferred embodiments, a solder ball is disposed in each solder ball hole and is electrically connected to one of the leads.


REFERENCES:
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5536909 (1996-07-01), DiStefano et al.
patent: 5590460 (1997-01-01), DiStefano et al.
patent: 5679194 (1997-10-01), Fjelstald et al.
patent: 6044548 (2000-04-01), Distefano et al.
patent: 6083837 (2000-07-01), Millet

Affiliated with

Also associated with

Rating

Connection component and method of making same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Connection component and method of making same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connection component and method of making same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2597144