connection arrangement for micro lead frame plastic packages

Details connection arrangement for micro lead frame plastic packages connection arrangement for micro lead frame plastic packages

2007-05-01

2007-05-01

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S662000, C257S663000, C257S665000, C257S670000, C257S672000, C257S690000, C257S678000, C257S728000

Reexamination Certificate

active

10999591

ABSTRACT:
A connection arrangement for a micro lead frame plastic (MLP) package is provided that includes a paddle configured to be connected to a circuit board and a first ground pad and a second ground pad each connected to the paddle. The first and second ground pads together with the paddle are configured to provide continuity of ground between the circuit board and a chip mounted to the paddle.

REFERENCES:
patent: 4172261 (1979-10-01), Tsuzuki et al.
patent: 5422664 (1995-06-01), Stephany
patent: 6566601 (2003-05-01), Maetani
patent: 6791166 (2004-09-01), Foster
patent: 7019389 (2006-03-01), Lai et al.
patent: 7026664 (2006-04-01), Divakar et al.
patent: 2005/0285234 (2005-12-01), Kanno
patent: 2006/0033188 (2006-02-01), Chen et al.

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