Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-01-04
2000-08-29
McCamish, Marion E.
Metal working
Method of mechanical manufacture
Electrical device making
29846, 29830, 428901, 4283202, H05K 310, H05K 336
Patent
active
061089036
ABSTRACT:
A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.
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Hatakeyama Akihito
Kawakita Kouji
Kojima Tamao
Nakatani Seiichi
Ogawa Tatsuo
Juska Cheryl
Matsushita Electric - Industrial Co., Ltd.
McCamish Marion E.
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