Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-07-03
2007-07-03
Le, Thao X. (Department: 2814)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C174S255000, C361S795000, C438S614000
Reexamination Certificate
active
11029423
ABSTRACT:
A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a necessary number of layers can be laminated and pressed collectively at a time. Bumps, which are formed approximately in a cone-shape, for connecting wiring films of a multilayer wiring substrate are embedded in a second resin film that serves as an interlayer insulating film.
REFERENCES:
patent: 5135606 (1992-08-01), Kato et al.
patent: 5600103 (1997-02-01), Odaira et al.
patent: 5822850 (1998-10-01), Odaira et al.
patent: 5865934 (1999-02-01), Yamamoto et al.
patent: 5915753 (1999-06-01), Motomura et al.
patent: 6204089 (2001-03-01), Wang
patent: 6237218 (2001-05-01), Ogawa et al.
patent: 6262376 (2001-07-01), Hurwitz et al.
patent: 6262478 (2001-07-01), Hurwitz et al.
patent: 6280640 (2001-08-01), Hurwitz et al.
patent: 6329610 (2001-12-01), Takubo et al.
patent: 6589870 (2003-07-01), Katoh
patent: 6601297 (2003-08-01), Schmidt
patent: 6684497 (2004-02-01), Appelt et al.
patent: 6705003 (2004-03-01), Motomura et al.
patent: 6709966 (2004-03-01), Hisatsune et al.
patent: 6872893 (2005-03-01), Fukuoka et al.
patent: 2001/0040794 (2001-11-01), Shimizu et al.
patent: 52-12458 (1993-08-01), None
patent: 408139450 (1996-05-01), None
patent: 408195561 (1996-07-01), None
patent: 409162553 (1997-06-01), None
patent: 11-298105 (1999-10-01), None
patent: 2001-326458 (2001-11-01), None
Endo Kimitaka
Iijima Tomoo
Le Thao X.
Tessera Interconnect Materials, Inc.
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