Connecting element using silicic acid particles to provide detac

Details Connecting element using silicic acid particles to provide detac Connecting element using silicic acid particles to provide detac

1994-02-18

1996-07-23

Watkins, III, William P.

Stock material or miscellaneous articles

Structurally defined web or sheet

Continuous and nonuniform or irregular surface on layer or...

428220, 428338, 428141, 428143, 428 414, 428343, 428355, 428331, 428323, 428448, B32B 516

Patent

active

055387802

ABSTRACT:
The invention relates to a connecting element comprises two strips adapted to be connected with the parts and/or bodies to be joined, and which after being thrust together detachably adhere together. In order to attain the aim of creating such a connecting element with an extremely low height and more particularly by pliancy and softness the first strip comprises a support tape of pliant material, on which a material composed of particles such as silicic acid with a size between fine-grained and pulverulent is adhered. The other strip may comprise a material with elastic and plastic properties.

REFERENCES:
patent: 4138527 (1979-02-01), Malek
patent: 4842988 (1989-06-01), Herrmann et al.
patent: 4941791 (1990-07-01), Iwamoto
patent: 5017457 (1991-05-01), Herrmann et al.
Database WPI, Sec. Ch, Week 9305, Derwent Pub. Ltd., London, GB; Class A14, AN 93-039425 & JP-A-04 363 377 (Pyramid KK), 16. Dec. 1992.
Patent Abstracts of Japan, vol. 016 No. 034 (M-1204), 28. Jan. 1992 & JP-A-03 243399 (Dainippon Printing Co. Ltd0 30 Oct. 1991.

Affiliated with

Also associated with

Rating

Connecting element using silicic acid particles to provide detac does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Connecting element using silicic acid particles to provide detac, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Connecting element using silicic acid particles to provide detac will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-711633