Connecting a flat-pack-packaged chip to a printed circuit board

Details Connecting a flat-pack-packaged chip to a printed circuit board Connecting a flat-pack-packaged chip to a printed circuit board

1984-08-13

1986-01-07

Buczinski, S. C.

Geometrical instruments

339 17R, H05K 100

Patent

active

H00000132

ABSTRACT:
A unique socket assembly is designed to interconnect a flat-pack-packaged integrated-circuit chip to a printed-circuit board in a manner that permits easy insertion and withdrawal of the packaged chip from the assembly. A base portion of the assembly includes a recess into which conductive cantilevered elements extend. When the packaged chip is positioned on these elements within the recess and a lid is placed on the base, secure but not permanent electrical contact is established between the elements and contact regions on the chip package.

REFERENCES:
patent: 3942855 (1976-03-01), de Villemur
patent: 3951495 (1976-04-01), Donaher et al.
patent: 4427247 (1984-01-01), Petersen
patent: 4427249 (1984-01-01), Bright
IBM Bulletin, DeBoskey, vol. 15, No. 1, p. 307, 6-1972.

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