Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1992-04-02
1993-08-31
Nguyen, Nam X.
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20429811, 20429818, C23C 1434
Patent
active
052405800
ABSTRACT:
An improved shielding assembly is provided for a sputter source which has an anode and cathode target-ring assembly mounted to a cylindrical mounting structure. A cooling assembly for the anode and cathode target-ring assembly is mounted to the distal end of the cylindrical mounting structure. A baffle shield member has an outer flat ring-shaped mounting base-portion which overlies the cooling assembly and from which a baffle portion inwardly extends toward the anode and cathode target-ring assembly. A shield member comprises an annular ring base portion, which is mounted over the outer flat ring-shaped mounting base-portion of the baffle shield member and from which an inner lip portion extends inwardly. The inner lip portion has a rounded contour to provide a smooth base for deposition of a smooth layer of sputtered material on said lip portion. The shield member includes a cylindrical sleeve portion, which is fixed to the annular ring base portion and which extends over the exterior wall of the cylindrical mounting structure to provide shielding of the exterior wall of the cylindrical mounting structure.
REFERENCES:
patent: 4414086 (1983-11-01), Lamont, Jr.
patent: 4472259 (1984-09-01), Class et al.
patent: 4564435 (1986-01-01), Wickersham
patent: 4661228 (1987-04-01), Mintz
patent: 4673480 (1987-06-01), Lamont, Jr.
Henderson David E.
Kreiss Forest P.
White Ronney L.
King Patrick T.
Nguyen Nam X.
VLSI Technology Inc.
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