Conformal barrier liner in an integrated circuit interconnect

Details Conformal barrier liner in an integrated circuit interconnect Conformal barrier liner in an integrated circuit interconnect

2006-01-24

2006-01-24

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S750000

Reexamination Certificate

active

06989604

ABSTRACT:
An integrated circuit having a substrate and a semiconductor device thereon. A stop layer over the substrate has a first dielectric layer formed thereon having an opening into which a first conformal barrier is formed. A first conformal barrier liner is formed in the opening, processed, and treated to improve adhesion. Portions of the first conformal barrier liner on the sidewalls act as a barrier to diffusion of conductor core material to the first dielectric layer. A conductor material is formed in the opening over the vertical portions of the first conformal barrier liner and the first stop layer.

REFERENCES:
patent: 5904565 (1999-05-01), Nguyen et al.
patent: 6040243 (2000-03-01), Li et al.
patent: 6239021 (2001-05-01), Pramanick et al.
patent: 6300236 (2001-10-01), Harper et al.
patent: 6455417 (2002-09-01), Bao et al.
patent: 6486059 (2002-11-01), Lee et al.

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