Confined lateral selective epitaxial growth

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156613, 156DIG64, 156DIG111, 148DIG26, 437 90, 437 78, 437927, C30B 2304, C30B 2504, H01L 21308

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049484567

ABSTRACT:
A method is disclosed for forming laterally grown epitaxial silicon without the requirement for subsequent thinning or planarization of the epitaxial silicon. Generally a low, wide cavity consisting of walls of dielectric material and having a side opening, or via hole, is formed and the epitaxial silicon is then selectively grown within the cavity. The resulting epitaxial silicon structure is characterized by being flat and wide with an aspect ratio of approximately 6 to 1.

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