Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-07-22
2008-07-22
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S612000, C438S613000, C438S508000, C438S508000
Reexamination Certificate
active
11430060
ABSTRACT:
Configuration for testing the bonding positions of conductive drops and test method by using the same is disclosed. In the invention, a special configured contact pad for setting a conductive drop and an associated wire pattern are useful for knowing the drop condition of single or several displaying panels. The contact pad comprises at least two conductive members respectively coupled to two wires; and an isolating portion between conductive members for separation. The normal dropping position of a conductive drop on the contact pad includes at least a portion of the conductive members. Accordingly, the contact pad is originally an open-circuit without conductive drop thereon, but the contact pad is conductive when the contact drop sets on its normal dropping position. Whether the conductive drop forms on the normal dropping position of the contact pad is determined by measuring the electrical properties of the contact pad.
REFERENCES:
patent: 5894170 (1999-04-01), Ishikawa
patent: 6650021 (2003-11-01), Stamper et al.
patent: 7135780 (2006-11-01), Jiang
patent: 2004/0135250 (2004-07-01), Hung
Chi Mei Optoelectronics Corp.
Le Dung A.
Thomas Kayden Horstemeyer & Risley
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