Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-10-29
2000-05-09
Bowers, Charles
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438639, 438640, 438672, H01L 214763
Patent
active
060603887
ABSTRACT:
An integrated circuit (IC) conductor and the process of making the conductor. The conductor may be a monofilament conductor, a clad conductor or a coaxial conductor. A trench is formed in a dielectric layer. An outer material layer is deposited on the dielectric layer and in the trench, thick enough that the outer material layer merges together in a seam over the trench forming a void under the seam. The outer material layer is dielectric for the monofilament conductor, a cladding material for the clad conductor and conducting material for the coaxial conductor. The void is filled with a conductor for a monofilament or clad conductors. An inner dielectric liner layer is formed on the walls of the void and a core conductor is formed on the liner layer for the coaxial conductor.
REFERENCES:
patent: 4776087 (1988-10-01), Cronin et al.
patent: 5338897 (1994-08-01), Tsay et al.
patent: 5363550 (1994-11-01), Aitken et al.
patent: 5403779 (1995-04-01), Joshi et al.
patent: 5510645 (1996-04-01), Fitch et al.
patent: 5550076 (1996-08-01), Chen
patent: 5661080 (1997-08-01), Hwang et al.
patent: 5670425 (1997-09-01), Schinella et al.
patent: 5801095 (1996-09-01), Huang et al.
patent: 5891807 (1997-09-01), Muller et al.
Akatsu Hiroyuki
Arndt Russell H.
Jones Bradley P.
Ouimet George F.
Anderson Jay L.
Berry Renee R.
Bowers Charles
International Business Machines - Corporation
LandOfFree
Conductors for microelectronic circuits and method of manufactur does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Conductors for microelectronic circuits and method of manufactur, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductors for microelectronic circuits and method of manufactur will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1064554