Conductor treating single-wafer type treating device and...

Coating apparatus – Gas or vapor deposition – With treating means

Reexamination Certificate

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C361S234000, C156S345530, C118S712000

Reexamination Certificate

active

10466116

ABSTRACT:
A single-substrate processing apparatus (20) has a worktable (40) disposed in a process chamber (24), which accommodates a target substrate (W). The worktable (40) has a thermally conductive mount surface (41) to place the target substrate (W) thereon. The worktable (40) is provided with a flow passage (50) formed therein, in which a thermal medium flows for adjusting temperature of the target substrate (W) through the mount surface (41). The flow passage (50) is connected to a thermal medium supply system (54), which selectively supplies a cooling medium and a heating medium.

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patent: 09-036097 (1997-02-01), None

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